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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL025T-FCS325

M2GL025T-FCS325

IC FPGA 180 I/O 325BGA

Microchip Technology

2,196 47.57
M2GL025T-FCS325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL025T-FCSG325

M2GL025T-FCSG325

IC FPGA 180 I/O 324CSBGA

Microchip Technology

4,232 47.57
M2GL025T-FCSG325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
AT40K20-2FQI

AT40K20-2FQI

IC FPGA 256 I/O 304PQFP

Microchip Technology

3,733 -

-

AT40K/KLV 304-BFQFP Tray Obsolete Not Verified - 1024 8192 256 30000 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C - - 304-PQFP (40x40)
A40MX04-FPLG84

A40MX04-FPLG84

IC FPGA 69 I/O 84PLCC

Microchip Technology

4,838 45.10
A40MX04-FPLG84

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 69 6000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 84-PLCC (29.31x29.31)
A3P250-1VQ100T

A3P250-1VQ100T

IC FPGA 68 I/O 100VQFP

Microchip Technology

1,841 -
A3P250-1VQ100T

数据手册

ProASIC3 100-TQFP Tray Obsolete Not Verified - - 36864 68 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 125°C (TA) Automotive AEC-Q100 100-VQFP (14x14)
A3P400-1FG256I

A3P400-1FG256I

IC FPGA 178 I/O 256FBGA

Microchip Technology

1,917 45.04
A3P400-1FG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 55296 178 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1A3P400-1FG256I

M1A3P400-1FG256I

IC FPGA 178 I/O 256FBGA

Microchip Technology

3,524 45.04

-

ProASIC3 256-LBGA Tray Active Not Verified - - 55296 178 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
A3P400-1FGG256I

A3P400-1FGG256I

IC FPGA 178 I/O 256FBGA

Microchip Technology

2,870 45.04
A3P400-1FGG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 55296 178 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1A3P400-1FGG256I

M1A3P400-1FGG256I

IC FPGA 178 I/O 256FBGA

Microchip Technology

2,777 45.04

-

ProASIC3 256-LBGA Tray Active Not Verified - - 55296 178 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1A3P600-1FG144

M1A3P600-1FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,889 45.42
M1A3P600-1FG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)