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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3P400-1FG144I

M1A3P400-1FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,279 39.52

-

ProASIC3 144-LBGA Tray Active Not Verified - - 55296 97 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
M2GL025-FCS325

M2GL025-FCS325

IC FPGA 180 I/O 325BGA

Microchip Technology

1,730 43.26
M2GL025-FCS325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL025-FCSG325

M2GL025-FCSG325

IC FPGA 180 I/O 324CSBGA

Microchip Technology

4,758 43.26
M2GL025-FCSG325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M1A3P400-1PQG208

M1A3P400-1PQG208

IC FPGA 151 I/O 208QFP

Microchip Technology

3,048 39.84

-

ProASIC3 208-BFQFP Tray Active Not Verified - - 55296 151 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
A3P400-1PQG208

A3P400-1PQG208

IC FPGA 151 I/O 208QFP

Microchip Technology

4,564 39.84
A3P400-1PQG208

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 55296 151 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
AT40K20-2BQJ

AT40K20-2BQJ

IC FPGA 114 I/O 144LQFP

Microchip Technology

4,985 43.56
AT40K20-2BQJ

数据手册

AT40K/KLV 144-LQFP Tray Active Not Verified - 1024 8192 114 30000 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TC) - - 144-LQFP (20x20)
M2GL010TS-FG484

M2GL010TS-FG484

IC FPGA 233 I/O 484FBGA

Microchip Technology

3,209 43.08
M2GL010TS-FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL010TS-FGG484

M2GL010TS-FGG484

IC FPGA 233 I/O 484FBGA

Microchip Technology

2,706 43.08
M2GL010TS-FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL010-1FG484I

M2GL010-1FG484I

IC FPGA 233 I/O 484FBGA

Microchip Technology

1,883 43.46
M2GL010-1FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL010-1FGG484I

M2GL010-1FGG484I

IC FPGA 233 I/O 484FBGA

Microchip Technology

1,186 43.46
M2GL010-1FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)