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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3P600-1FGG144

M1A3P600-1FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,425 45.42
M1A3P600-1FGG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
A3P600-1FGG144

A3P600-1FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,460 45.42
A3P600-1FGG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
A3P600-1FG144

A3P600-1FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,023 45.42
A3P600-1FG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
M2GL010TS-1FG484

M2GL010TS-1FG484

IC FPGA 233 I/O 484FBGA

Microchip Technology

1,611 48.26
M2GL010TS-1FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL010TS-1FGG484

M2GL010TS-1FGG484

IC FPGA 233 I/O 484FBGA

Microchip Technology

3,847 48.26
M2GL010TS-1FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL010TS-FG484I

M2GL010TS-FG484I

IC FPGA 233 I/O 484FBGA

Microchip Technology

1,402 48.26
M2GL010TS-FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL010TS-FGG484I

M2GL010TS-FGG484I

IC FPGA 233 I/O 484FBGA

Microchip Technology

2,470 48.26
M2GL010TS-FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL025-1FCS325

M2GL025-1FCS325

IC FPGA 180 I/O 325BGA

Microchip Technology

1,582 49.75
M2GL025-1FCS325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL025-1FCSG325

M2GL025-1FCSG325

IC FPGA 180 I/O 324CSBGA

Microchip Technology

3,075 49.75
M2GL025-1FCSG325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL025-FCS325I

M2GL025-FCS325I

IC FPGA 180 I/O 325BGA

Microchip Technology

1,630 49.75
M2GL025-FCS325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)