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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL025T-1FCSG325

M2GL025T-1FCSG325

IC FPGA 180 I/O 324CSBGA

Microchip Technology

1,551 54.07
M2GL025T-1FCSG325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL025T-FCS325I

M2GL025T-FCS325I

IC FPGA 180 I/O 325BGA

Microchip Technology

1,212 54.07
M2GL025T-FCS325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL025T-FCSG325I

M2GL025T-FCSG325I

IC FPGA 180 I/O 324CSBGA

Microchip Technology

4,408 54.07
M2GL025T-FCSG325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL025TS-FCS325

M2GL025TS-FCS325

IC FPGA 180 I/O 325BGA

Microchip Technology

1,404 54.07
M2GL025TS-FCS325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL025TS-FCSG325

M2GL025TS-FCSG325

IC FPGA 180 I/O 324CSBGA

Microchip Technology

4,798 54.07
M2GL025TS-FCSG325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
AT40K40AL-1DQU

AT40K40AL-1DQU

IC FPGA 114 I/O 208QFP

Microchip Technology

3,115 49.70
AT40K40AL-1DQU

数据手册

AT40KAL 208-BFQFP Tray Active Not Verified - 2304 18432 114 50000 3V ~ 3.6V Surface Mount 0°C ~ 70°C (TC) - - 208-PQFP (28x28)
M1A3P600-1FG256

M1A3P600-1FG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,988 50.23
M1A3P600-1FG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P600-1FG256

A3P600-1FG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

3,090 50.23
A3P600-1FG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P600-1FGG256

A3P600-1FGG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

1,485 50.23
A3P600-1FGG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M1A3P600-1FGG256

M1A3P600-1FGG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

1,156 50.23
M1A3P600-1FGG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)