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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL010TS-1FG484I

M2GL010TS-1FG484I

IC FPGA 233 I/O 484FBGA

Microchip Technology

4,325 53.42
M2GL010TS-1FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL010TS-1FGG484I

M2GL010TS-1FGG484I

IC FPGA 233 I/O 484FBGA

Microchip Technology

1,158 53.42
M2GL010TS-1FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
AGL400V5-FG256

AGL400V5-FG256

IC FPGA 178 I/O 256FBGA

Microchip Technology

1,980 50.57
AGL400V5-FG256

数据手册

IGLOO 256-LBGA Tray Active Not Verified - 9216 55296 178 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
A3P600-1PQG208

A3P600-1PQG208

IC FPGA 154 I/O 208QFP

Microchip Technology

3,911 50.91
A3P600-1PQG208

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 110592 154 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
M1A3P600-1PQG208

M1A3P600-1PQG208

IC FPGA 154 I/O 208QFP

Microchip Technology

3,954 50.91
M1A3P600-1PQG208

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 110592 154 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
M2GL025-1FCS325I

M2GL025-1FCS325I

IC FPGA 180 I/O 325BGA

Microchip Technology

1,475 56.22
M2GL025-1FCS325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL025-1FCSG325I

M2GL025-1FCSG325I

IC FPGA 180 I/O 324CSBGA

Microchip Technology

2,583 56.22
M2GL025-1FCSG325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
A40MX04-FVQG80

A40MX04-FVQG80

IC FPGA 69 I/O 80VQFP

Microchip Technology

1,105 52.05
A40MX04-FVQG80

数据手册

MX 80-TQFP Tray Active Not Verified - - - 69 6000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 80-VQFP (14x14)
M1A3P600-1FGG144I

M1A3P600-1FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,406 52.25
M1A3P600-1FGG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P600-1FGG144I

A3P600-1FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,820 52.25
A3P600-1FGG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)