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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3P400-2FGG256I

M1A3P400-2FGG256I

IC FPGA 178 I/O 256FBGA

Microchip Technology

4,716 48.94

-

ProASIC3 256-LBGA Tray Active Not Verified - - 55296 178 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
A3P400-2FG256I

A3P400-2FG256I

IC FPGA 178 I/O 256FBGA

Microchip Technology

2,821 48.94
A3P400-2FG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 55296 178 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1A3P400-2FG256I

M1A3P400-2FG256I

IC FPGA 178 I/O 256FBGA

Microchip Technology

2,958 48.94

-

ProASIC3 256-LBGA Tray Active Not Verified - - 55296 178 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1A3P600-2FGG144

M1A3P600-2FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,858 49.10
M1A3P600-2FGG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
M1A3P600-2FG144

M1A3P600-2FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,983 49.10
M1A3P600-2FG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
A3P600-2FG144

A3P600-2FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,341 49.10
A3P600-2FG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
A3P400-2PQG208I

A3P400-2PQG208I

IC FPGA 151 I/O 208QFP

Microchip Technology

4,071 49.34
A3P400-2PQG208I

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 55296 151 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
M1A3P400-2PQG208I

M1A3P400-2PQG208I

IC FPGA 151 I/O 208QFP

Microchip Technology

1,184 49.34

-

ProASIC3 208-BFQFP Tray Active Not Verified - - 55296 151 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
A54SX08A-FTQG100

A54SX08A-FTQG100

IC FPGA 81 I/O 100TQFP

Microchip Technology

3,851 49.66
A54SX08A-FTQG100

数据手册

SX-A 100-LQFP Tray Active Not Verified 768 - - 81 12000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-TQFP (14x14)
M2GL025T-1FCS325

M2GL025T-1FCS325

IC FPGA 180 I/O 325BGA

Microchip Technology

1,848 54.07
M2GL025T-1FCS325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)