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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
APA300-PQG208M

APA300-PQG208M

IC FPGA 158 I/O 208QFP

Microchip Technology

4,533 536.10
APA300-PQG208M

数据手册

ProASICPLUS 208-BFQFP Tray Active Not Verified - - 73728 158 300000 2.3V ~ 2.7V Surface Mount -55°C ~ 125°C (TC) - - 208-PQFP (28x28)
MPF300TS-FCG784NI

MPF300TS-FCG784NI

IC FPGA 388 I/O 784FCBGA

Microchip Technology

3,947 592.66
MPF300TS-FCG784NI

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 300000 21600666 388 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
APA600-PQG208M

APA600-PQG208M

IC FPGA 158 I/O 208QFP

Microchip Technology

4,570 995.65
APA600-PQG208M

数据手册

ProASICPLUS 208-BFQFP Tray Active Not Verified - - 129024 158 600000 2.3V ~ 2.7V Surface Mount -55°C ~ 125°C (TC) - - 208-PQFP (28x28)
M2GL005-1VFG256

M2GL005-1VFG256

IC FPGA 161 I/O 256FBGA

Microchip Technology

1,667 14.71
M2GL005-1VFG256

数据手册

IGLOO2 256-LFBGA Tray Active Not Verified - 6060 719872 161 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (14x14)
M2GL010-FG484I

M2GL010-FG484I

IC FPGA 233 I/O 484FBGA

Microchip Technology

3,256 38.44
M2GL010-FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A3P400-1FGG256

A3P400-1FGG256

IC FPGA 178 I/O 256FBGA

Microchip Technology

4,226 39.16
A3P400-1FGG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 55296 178 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
MPF050T-FCSG325E

MPF050T-FCSG325E

MPF050T-FCSG325E

Microchip Technology

4,191 -
MPF050T-FCSG325E

数据手册

- 325-TFBGA Tray Active Not Verified 48000 3774874 - 164 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 325-BGA (11x11)
A3P1000-1PQG208I

A3P1000-1PQG208I

IC FPGA 154 I/O 208QFP

Microchip Technology

4,987 91.85
A3P1000-1PQG208I

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
M2GL010T-1FG484M

M2GL010T-1FG484M

IC FPGA 233 I/O 484FBGA

Microchip Technology

4,383 93.60
M2GL010T-1FG484M

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
MPF050T-1FCSG325E

MPF050T-1FCSG325E

MPF050T-1FCSG325E

Microchip Technology

1,719 -
MPF050T-1FCSG325E

数据手册

- 325-TFBGA Tray Active Not Verified 48000 3774874 - 164 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 325-BGA (11x11)