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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
MPF200T-FCG784I

MPF200T-FCG784I

IC FPGA 364 I/O 784FCBGA

Microchip Technology

2,572 325.10
MPF200T-FCG784I

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 192000 13619200 364 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
MPF300T-FCG484E

MPF300T-FCG484E

IC FPGA 244 I/O 484FCBGA

Microchip Technology

1,440 380.99
MPF300T-FCG484E

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 244 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 484-FCBGA (23x23)
MPF300T-FCSG536I

MPF300T-FCSG536I

IC FPGA 300 I/O 536CSPBGA

Microchip Technology

2,170 604.64
MPF300T-FCSG536I

数据手册

PolarFire™ 536-LFBGA, CSPBGA Tray Active Not Verified - 300000 21094400 300 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 536-CSPBGA (16x16)
MPF300TS-1FCG484I

MPF300TS-1FCG484I

IC FPGA 244 I/O 484FCBGA

Microchip Technology

3,851 609.60
MPF300TS-1FCG484I

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 244 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FCBGA (23x23)
MPF500T-FCG784E

MPF500T-FCG784E

IC FPGA 388 I/O 784FCBGA

Microchip Technology

3,215 678.74
MPF500T-FCG784E

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 481000 33792000 388 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
MPF300TS-1FCG784NI

MPF300TS-1FCG784NI

IC FPGA 388 I/O 784FCBGA

Microchip Technology

4,569 677.32
MPF300TS-1FCG784NI

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 300000 21600666 388 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
A42MX16-PQG160M

A42MX16-PQG160M

IC FPGA 125 I/O 160QFP

Microchip Technology

2,236 756.10
A42MX16-PQG160M

数据手册

MX 160-BQFP Tray Active Not Verified - - - 125 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -55°C ~ 125°C (TC) - - 160-PQFP (28x28)
APA600-BG456I

APA600-BG456I

IC FPGA 356 I/O 456BGA

Microchip Technology

2,834 775.81
APA600-BG456I

数据手册

ProASICPLUS 456-BBGA Tray Active Not Verified - - 129024 356 600000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 456-PBGA (35x35)
MPF500TS-FCG1152I

MPF500TS-FCG1152I

IC FPGA 584 I/O 1152FCBGA

Microchip Technology

2,766 1045.25
MPF500TS-FCG1152I

数据手册

PolarFire™ 1152-BBGA, FCBGA Tray Active Not Verified - 481000 33792000 584 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
M2GL005-FGG484I

M2GL005-FGG484I

IC FPGA 209 I/O 484FBGA

Microchip Technology

1,835 18.09
M2GL005-FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 6060 719872 209 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)