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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
MPF200T-1FCVG484I

MPF200T-1FCVG484I

IC FPGA 284 I/O 484FBGA

Microchip Technology

3,428 392.58
MPF200T-1FCVG484I

数据手册

PolarFire™ 484-BFBGA Tray Active Not Verified - 192000 13619200 284 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (19x19)
MPF300T-FCG784NE

MPF300T-FCG784NE

POLARFIRE MID-RANGE FPGA, 300KLE

Microchip Technology

4,094 -
MPF300T-FCG784NE

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active - 75000 300000 21600666 388 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
MPF300T-FCVG484E

MPF300T-FCVG484E

IC FPGA 284 I/O 484FCBGA

Microchip Technology

1,108 438.13
MPF300T-FCVG484E

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 284 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
MPF300T-1FCG784NE

MPF300T-1FCG784NE

POLARFIRE MID-RANGE FPGA, 300KLE

Microchip Technology

4,031 -
MPF300T-1FCG784NE

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active - 75000 300000 21600666 388 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
MPF200TLS-FCSG325I

MPF200TLS-FCSG325I

IC FPGA 170 I/O 325FPGA

Microchip Technology

2,373 515.94
MPF200TLS-FCSG325I

数据手册

PolarFire™ 325-LFBGA, FC Tray Active Not Verified - 192000 13619200 170 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x14.5)
MPF300T-1FCG784I

MPF300T-1FCG784I

IC FPGA 388 I/O 784FCBGA

Microchip Technology

2,257 592.66
MPF300T-1FCG784I

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 388 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
A54SX72A-2PQG208I

A54SX72A-2PQG208I

IC FPGA 171 I/O 208QFP

Microchip Technology

1,716 557.57
A54SX72A-2PQG208I

数据手册

SX-A 208-BFQFP Tray Active Not Verified 6036 - - 171 108000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
MPF200TS-1FCSG536I

MPF200TS-1FCSG536I

IC FPGA 300 I/O 536CSPBGA

Microchip Technology

4,723 593.35
MPF200TS-1FCSG536I

数据手册

PolarFire™ 536-LFBGA, CSPBGA Tray Active Not Verified - 192000 13619200 300 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 536-CSPBGA (16x16)
AX1000-FG484I

AX1000-FG484I

IC FPGA 317 I/O 484FBGA

Microchip Technology

4,837 652.46
AX1000-FG484I

数据手册

Axcelerator 484-BGA Tray Active Not Verified 18144 - 165888 317 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)
AX2000-FG896

AX2000-FG896

IC FPGA 586 I/O 896FBGA

Microchip Technology

4,923 1064.22
AX2000-FG896

数据手册

Axcelerator 896-BGA Tray Active Not Verified 32256 - 294912 586 2000000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 896-FBGA (31x31)