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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
APA450-BG456I

APA450-BG456I

IC FPGA 344 I/O 456BGA

Microchip Technology

1,810 473.45
APA450-BG456I

数据手册

ProASICPLUS 456-BBGA Tray Active Not Verified - - 110592 344 450000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 456-PBGA (35x35)
MPF300TS-FCG1152I

MPF300TS-FCG1152I

IC FPGA 512 I/O 1152FCBGA

Microchip Technology

4,447 651.92
MPF300TS-FCG1152I

数据手册

PolarFire™ 1152-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 512 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
A3P1000-FGG256I

A3P1000-FGG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

4,631 81.46
A3P1000-FGG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
APA150-FG144I

APA150-FG144I

IC FPGA 100 I/O 144FBGA

Microchip Technology

1,474 168.43
APA150-FG144I

数据手册

ProASICPLUS 144-LBGA Tray Active Not Verified - - 36864 100 150000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
MPF100T-FCG484I

MPF100T-FCG484I

IC FPGA 244 I/O 484FCBGA

Microchip Technology

1,221 196.94
MPF100T-FCG484I

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 109000 7782400 244 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FCBGA (23x23)
MPF300T-1FCG484I

MPF300T-1FCG484I

IC FPGA 244 I/O 484FCBGA

Microchip Technology

2,880 533.38
MPF300T-1FCG484I

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 244 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FCBGA (23x23)
MPF200T-FCG484I

MPF200T-FCG484I

IC FPGA 244 I/O 484FCBGA

Microchip Technology

3,516 292.60
MPF200T-FCG484I

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 192000 13619200 244 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FCBGA (23x23)
MPF300T-1FCG484E

MPF300T-1FCG484E

IC FPGA 244 I/O 484FCBGA

Microchip Technology

3,667 457.19
MPF300T-1FCG484E

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 244 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 484-FCBGA (23x23)
M2GL005-TQG144I

M2GL005-TQG144I

IC FPGA 84 I/O 144TQFP

Microchip Technology

4,370 12.73
M2GL005-TQG144I

数据手册

IGLOO2 - Tray Active Not Verified - 6060 719872 84 - 1.14V ~ 2.625V - -40°C ~ 100°C (TJ) - - -
EX256-FTQG100

EX256-FTQG100

IC FPGA 81 I/O 100TQFP

Microchip Technology

2,298 46.49
EX256-FTQG100

数据手册

EX 100-LQFP Tray Active Not Verified - 512 - 81 12000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 100-TQFP (14x14)