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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3PE1500-2FG484I

A3PE1500-2FG484I

IC FPGA 280 I/O 484FBGA

Microchip Technology

4,337 245.76
A3PE1500-2FG484I

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
AGL030V5-VQ100I

AGL030V5-VQ100I

IC FPGA 77 I/O 100VQFP

Microchip Technology

2,897 6.72
AGL030V5-VQ100I

数据手册

IGLOO 100-TQFP Tray Active Not Verified - 768 - 77 30000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 100-VQFP (14x14)
A3P1000-2PQG208I

A3P1000-2PQG208I

IC FPGA 154 I/O 208QFP

Microchip Technology

2,968 99.47
A3P1000-2PQG208I

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
MPF050T-1FCSG325I

MPF050T-1FCSG325I

MPF050T-1FCSG325I

Microchip Technology

1,256 -
MPF050T-1FCSG325I

数据手册

- 325-TFBGA Tray Active Not Verified 48000 3774874 - 164 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 325-BGA (11x11)
A3PE1500-2PQG208I

A3PE1500-2PQG208I

IC FPGA 147 I/O 208QFP

Microchip Technology

2,716 229.70
A3PE1500-2PQG208I

数据手册

ProASIC3E 208-BFQFP Tray Active Not Verified - - 276480 147 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
MPF200T-1FCG784I

MPF200T-1FCG784I

IC FPGA 364 I/O 784FCBGA

Microchip Technology

2,109 379.31
MPF200T-1FCG784I

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 192000 13619200 364 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
A3PE3000-FGG484I

A3PE3000-FGG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

2,684 433.52
A3PE3000-FGG484I

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
MPF300TLS-FCG1152I

MPF300TLS-FCG1152I

IC FPGA 512 I/O 1152FCBGA

Microchip Technology

3,521 745.05
MPF300TLS-FCG1152I

数据手册

PolarFire™ 1152-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 512 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
A3PN020-QNG68

A3PN020-QNG68

IC FPGA 49 I/O 68QFN

Microchip Technology

2,452 -
A3PN020-QNG68

数据手册

ProASIC3 nano 68-VFQFN Exposed Pad Tray Active Not Verified - - - 49 20000 1.425V ~ 1.575V Surface Mount -20°C ~ 85°C (TJ) - - 68-QFN (8x8)
A3PN015-1QNG68

A3PN015-1QNG68

IC FPGA 49 I/O 68QFN

Microchip Technology

2,104 4.49
A3PN015-1QNG68

数据手册

ProASIC3 nano 68-VFQFN Exposed Pad Tray Active Not Verified - - - 49 15000 1.425V ~ 1.575V Surface Mount -20°C ~ 85°C (TJ) - - 68-QFN (8x8)