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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3P030-2QNG68

A3P030-2QNG68

IC FPGA 49 I/O 68QFN

Microchip Technology

1,509 5.70
A3P030-2QNG68

数据手册

ProASIC3 68-VFQFN Exposed Pad Tray Active Not Verified - - - 49 30000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 68-QFN (8x8)
AGL030V5-VQG100

AGL030V5-VQG100

IC FPGA 77 I/O 100VQFP

Microchip Technology

3,966 -
AGL030V5-VQG100

数据手册

IGLOO 100-TQFP Tray Active Not Verified - 768 - 77 30000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 100-VQFP (14x14)
AGL030V5-VQ100

AGL030V5-VQ100

IC FPGA 77 I/O 100VQFP

Microchip Technology

2,606 5.86
AGL030V5-VQ100

数据手册

IGLOO 100-TQFP Tray Active Not Verified - 768 - 77 30000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 100-VQFP (14x14)
A3PN020-2QNG68I

A3PN020-2QNG68I

IC FPGA 49 I/O 68QFN

Microchip Technology

4,248 5.83
A3PN020-2QNG68I

数据手册

ProASIC3 nano 68-VFQFN Exposed Pad Tray Active Not Verified - - - 49 20000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 68-QFN (8x8)
A3P030-QNG48

A3P030-QNG48

IC FPGA 34 I/O 48QFN

Microchip Technology

3,409 -
A3P030-QNG48

数据手册

ProASIC3 48-VFQFN Exposed Pad Tray Active Not Verified - - - 34 30000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 48-QFN (6x6)
AGLN010V2-UCG36

AGLN010V2-UCG36

IC FPGA 23 I/O 36UCSP

Microchip Technology

2,250 -
AGLN010V2-UCG36

数据手册

IGLOO nano 36-WFBGA, CSPBGA Tray Obsolete Not Verified - 260 - 23 10000 1.14V ~ 1.575V Surface Mount -20°C ~ 85°C (TJ) - - 36-UCSP (3x3)
A3P030-VQ100

A3P030-VQ100

IC FPGA 77 I/O 100VQFP

Microchip Technology

1,624 5.87
A3P030-VQ100

数据手册

ProASIC3 100-TQFP Tray Active Not Verified - - - 77 30000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 100-VQFP (14x14)
AGLN010V2-QNG48

AGLN010V2-QNG48

IC FPGA 34 I/O 48QFN

Microchip Technology

1,350 -
AGLN010V2-QNG48

数据手册

IGLOO nano 48-VFQFN Exposed Pad Tray Active Not Verified - 260 - 34 10000 1.14V ~ 1.575V Surface Mount -20°C ~ 85°C (TJ) - - 48-QFN (6x6)
AGLN010V5-UCG36I

AGLN010V5-UCG36I

IC FPGA 23 I/O 36UCSP

Microchip Technology

4,710 6.06
AGLN010V5-UCG36I

数据手册

IGLOO nano 36-WFBGA, CSPBGA Tray Active Not Verified - 260 - 23 10000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 36-UCSP (3x3)
A3P030-2QNG48I

A3P030-2QNG48I

IC FPGA 34 I/O 48QFN

Microchip Technology

1,824 6.18
A3P030-2QNG48I

数据手册

ProASIC3 48-VFQFN Exposed Pad Tray Active Not Verified - - - 34 30000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 48-QFN (6x6)