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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3PN015-2QNG68

A3PN015-2QNG68

IC FPGA 49 I/O 68QFN

Microchip Technology

3,213 4.68
A3PN015-2QNG68

数据手册

ProASIC3 nano 68-VFQFN Exposed Pad Tray Active Not Verified - - - 49 15000 1.425V ~ 1.575V Surface Mount -20°C ~ 85°C (TJ) - - 68-QFN (8x8)
A3PN020-1QNG68

A3PN020-1QNG68

IC FPGA 49 I/O 68QFN

Microchip Technology

1,251 4.68
A3PN020-1QNG68

数据手册

ProASIC3 nano 68-VFQFN Exposed Pad Tray Active Not Verified - - - 49 20000 1.425V ~ 1.575V Surface Mount -20°C ~ 85°C (TJ) - - 68-QFN (8x8)
A3PN020-QNG68I

A3PN020-QNG68I

IC FPGA 49 I/O 68QFN

Microchip Technology

4,297 -
A3PN020-QNG68I

数据手册

ProASIC3 nano 68-VFQFN Exposed Pad Tray Active Not Verified - - - 49 20000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 68-QFN (8x8)
A3PN020-2QNG68

A3PN020-2QNG68

IC FPGA 49 I/O 68QFN

Microchip Technology

3,889 5.07
A3PN020-2QNG68

数据手册

ProASIC3 nano 68-VFQFN Exposed Pad Tray Active Not Verified - - - 49 20000 1.425V ~ 1.575V Surface Mount -20°C ~ 85°C (TJ) - - 68-QFN (8x8)
A3PN015-1QNG68I

A3PN015-1QNG68I

IC FPGA 49 I/O 68QFN

Microchip Technology

3,422 5.18
A3PN015-1QNG68I

数据手册

ProASIC3 nano 68-VFQFN Exposed Pad Tray Active Not Verified - - - 49 15000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 68-QFN (8x8)
A3P030-2QNG48

A3P030-2QNG48

IC FPGA 34 I/O 48QFN

Microchip Technology

3,725 5.37
A3P030-2QNG48

数据手册

ProASIC3 48-VFQFN Exposed Pad Tray Active Not Verified - - - 34 30000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 48-QFN (6x6)
A3P030-1QNG68

A3P030-1QNG68

IC FPGA 49 I/O 68QFN

Microchip Technology

4,736 5.37
A3P030-1QNG68

数据手册

ProASIC3 68-VFQFN Exposed Pad Tray Active Not Verified - - - 49 30000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 68-QFN (8x8)
A3PN015-2QNG68I

A3PN015-2QNG68I

IC FPGA 49 I/O 68QFN

Microchip Technology

3,507 5.38
A3PN015-2QNG68I

数据手册

ProASIC3 nano 68-VFQFN Exposed Pad Tray Active Not Verified - - - 49 15000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 68-QFN (8x8)
A3PN020-1QNG68I

A3PN020-1QNG68I

IC FPGA 49 I/O 68QFN

Microchip Technology

2,326 5.38
A3PN020-1QNG68I

数据手册

ProASIC3 nano 68-VFQFN Exposed Pad Tray Active Not Verified - - - 49 20000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 68-QFN (8x8)
AGLN010V5-QNG48

AGLN010V5-QNG48

IC FPGA 34 I/O 48QFN

Microchip Technology

1,303 -
AGLN010V5-QNG48

数据手册

IGLOO nano 48-VFQFN Exposed Pad Tray Active Not Verified - 260 - 34 10000 1.425V ~ 1.575V Surface Mount -20°C ~ 85°C (TJ) - - 48-QFN (6x6)