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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
MPF100T-1FCG484I

MPF100T-1FCG484I

IC FPGA 244 I/O 484FCBGA

Microchip Technology

3,822 229.77
MPF100T-1FCG484I

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 109000 7782400 244 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FCBGA (23x23)
MPF100T-1FCSG325E

MPF100T-1FCSG325E

IC FPGA 170 I/O 325FPGA

Microchip Technology

4,466 256.01
MPF100T-1FCSG325E

数据手册

PolarFire™ 325-LFBGA, FCBGA Tray Active Not Verified - 109000 7782400 170 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
MPF200TS-FCG484I

MPF200TS-FCG484I

IC FPGA 244 I/O 484FCBGA

Microchip Technology

4,344 341.38
MPF200TS-FCG484I

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 192000 13619200 244 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FCBGA (23x23)
MPF300T-FCG1152E

MPF300T-FCG1152E

IC FPGA 512 I/O 1152FCBGA

Microchip Technology

1,327 465.66
MPF300T-FCG1152E

数据手册

PolarFire™ 1152-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 512 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
MPF300T-FCG784NI

MPF300T-FCG784NI

IC FPGA 388 I/O 784FCBGA

Microchip Technology

1,363 507.98
MPF300T-FCG784NI

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 300000 21600666 388 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
MPF500T-FCG784I

MPF500T-FCG784I

IC FPGA 388 I/O 784FCBGA

Microchip Technology

3,326 814.48
MPF500T-FCG784I

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 481000 33792000 388 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
MPF500T-1FCG1152I

MPF500T-1FCG1152I

IC FPGA 584 I/O 1152FCBGA

Microchip Technology

1,832 1045.25
MPF500T-1FCG1152I

数据手册

PolarFire™ 1152-BBGA, FCBGA Tray Active Not Verified - 481000 33792000 584 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
MPF500TS-1FCG1152I

MPF500TS-1FCG1152I

IC FPGA 584 I/O 1152FCBGA

Microchip Technology

2,003 1194.58
MPF500TS-1FCG1152I

数据手册

PolarFire™ 1152-BBGA, FCBGA Tray Active Not Verified - 481000 33792000 584 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
A3P060-FGG144

A3P060-FGG144

IC FPGA 96 I/O 144FBGA

Microchip Technology

3,125 10.73
A3P060-FGG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 18432 96 60000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
M2GL025T-1FG484M

M2GL025T-1FG484M

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,930 161.81
M2GL025T-1FG484M

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)