产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
AGL1000V5-FG144I

AGL1000V5-FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,323 -
AGL1000V5-FG144I

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 24576 147456 97 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
A3P1000L-FGG144

A3P1000L-FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,711 -
A3P1000L-FGG144

数据手册

ProASIC3L 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
A3P600-FGG144I

A3P600-FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,588 -
A3P600-FGG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P600L-FGG144I

A3P600L-FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,805 -
A3P600L-FGG144I

数据手册

ProASIC3L 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P600-2FG144I

A3P600-2FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,262 -
A3P600-2FG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A54SX08-1FG144

A54SX08-1FG144

IC FPGA 111 I/O 144FBGA

Microchip Technology

3,897 -
A54SX08-1FG144

数据手册

SX 144-LBGA Tray Active Not Verified 768 - - 111 12000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 144-FPBGA (13x13)
APA075-FG144I

APA075-FG144I

IC FPGA 100 I/O 144FBGA

Microchip Technology

3,700 -
APA075-FG144I

数据手册

ProASICPLUS 144-LBGA Tray Active Not Verified - - 27648 100 75000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
APA075-FGG144I

APA075-FGG144I

IC FPGA 100 I/O 144FBGA

Microchip Technology

1,810 -
APA075-FGG144I

数据手册

ProASICPLUS 144-LBGA Tray Active Not Verified - - 27648 100 75000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
A54SX08-FGG144

A54SX08-FGG144

IC FPGA 111 I/O 144FBGA

Microchip Technology

4,949 -
A54SX08-FGG144

数据手册

SX 144-LBGA Tray Active Not Verified 768 - - 111 12000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 144-FPBGA (13x13)
EX128-FTQ64

EX128-FTQ64

IC FPGA 46 I/O 64TQFP

Microchip Technology

2,316 -
EX128-FTQ64

数据手册

EX 64-LQFP Tray Obsolete Not Verified - 256 - 46 6000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 64-TQFP (10x10)