产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
EX128-TQ64

EX128-TQ64

IC FPGA 46 I/O 64TQFP

Microchip Technology

3,734 -
EX128-TQ64

数据手册

EX 64-LQFP Tray Obsolete Verified - 256 - 46 6000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 64-TQFP (10x10)
EX128-TQG64

EX128-TQG64

IC FPGA 46 I/O 64TQFP

Microchip Technology

2,720 -
EX128-TQG64

数据手册

EX 64-LQFP Tray Active Not Verified - 256 - 46 6000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 64-TQFP (10x10)
APA075-FGG144

APA075-FGG144

IC FPGA 100 I/O 144FBGA

Microchip Technology

1,401 -
APA075-FGG144

数据手册

ProASICPLUS 144-LBGA Tray Active Not Verified - - 27648 100 75000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 144-FPBGA (13x13)
AGL125V5-FG144I

AGL125V5-FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,843 -
AGL125V5-FG144I

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 3072 36864 97 125000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
A3P600-FG144

A3P600-FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,013 -
A3P600-FG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
AGL125V2-FG144I

AGL125V2-FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,535 -
AGL125V2-FG144I

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 3072 36864 97 125000 1.14V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
EX64-TQ64I

EX64-TQ64I

IC FPGA 41 I/O 64TQFP

Microchip Technology

2,638 -
EX64-TQ64I

数据手册

EX 64-LQFP Tray Obsolete Verified - 128 - 41 3000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 64-TQFP (10x10)
A3P060-FGG144I

A3P060-FGG144I

IC FPGA 96 I/O 144FBGA

Microchip Technology

3,585 -
A3P060-FGG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 18432 96 60000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P400-FG144

A3P400-FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,011 -
A3P400-FG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 55296 97 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
EX128-PTQ64

EX128-PTQ64

IC FPGA 46 I/O 64TQFP

Microchip Technology

1,302 -
EX128-PTQ64

数据手册

EX 64-LQFP Tray Obsolete Not Verified - 256 - 46 6000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 64-TQFP (10x10)