产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3P600L-1FGG144

A3P600L-1FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,478 -
A3P600L-1FGG144

数据手册

ProASIC3L 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
EX128-PTQ64I

EX128-PTQ64I

IC FPGA 46 I/O 64TQFP

Microchip Technology

3,483 -
EX128-PTQ64I

数据手册

EX 64-LQFP Tray Obsolete Not Verified - 256 - 46 6000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 64-TQFP (10x10)
APA075-FG144

APA075-FG144

IC FPGA 100 I/O 144FBGA

Microchip Technology

4,982 -
APA075-FG144

数据手册

ProASICPLUS 144-LBGA Tray Active Not Verified - - 27648 100 75000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 144-FPBGA (13x13)
A3P400-FGG144

A3P400-FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,461 -
A3P400-FGG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 55296 97 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
A3P600L-FGG144

A3P600L-FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,358 -
A3P600L-FGG144

数据手册

ProASIC3L 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
EX64-PTQ64

EX64-PTQ64

IC FPGA 41 I/O 64TQFP

Microchip Technology

3,410 -
EX64-PTQ64

数据手册

EX 64-LQFP Tray Obsolete Not Verified - 128 - 41 3000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 64-TQFP (10x10)
A3P400-FG144I

A3P400-FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,977 -
A3P400-FG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 55296 97 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P400-FGG144I

A3P400-FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,654 -
A3P400-FGG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 55296 97 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P600-2FGG144

A3P600-2FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,341 -
A3P600-2FGG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
EX64-PTQ64I

EX64-PTQ64I

IC FPGA 41 I/O 64TQFP

Microchip Technology

2,742 -
EX64-PTQ64I

数据手册

EX 64-LQFP Tray Obsolete Not Verified - 128 - 41 3000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 64-TQFP (10x10)