产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
EX128-FTQG64

EX128-FTQG64

IC FPGA 46 I/O 64TQFP

Microchip Technology

1,687 -
EX128-FTQG64

数据手册

EX 64-LQFP Tray Active Not Verified - 256 - 46 6000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 64-TQFP (10x10)
AGL1000V2-FGG144I

AGL1000V2-FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,209 -
AGL1000V2-FGG144I

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 24576 147456 97 1000000 1.14V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
A3P1000L-FG144I

A3P1000L-FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,985 -
A3P1000L-FG144I

数据手册

ProASIC3L 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
APA450-FG144I

APA450-FG144I

IC FPGA 100 I/O 144FBGA

Microchip Technology

3,297 -
APA450-FG144I

数据手册

ProASICPLUS 144-LBGA Tray Active Not Verified - - 110592 100 450000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
APA450-FGG144I

APA450-FGG144I

IC FPGA 100 I/O 144FBGA

Microchip Technology

1,530 -
APA450-FGG144I

数据手册

ProASICPLUS 144-LBGA Tray Active Not Verified - - 110592 100 450000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
EX128-TQG64I

EX128-TQG64I

IC FPGA 46 I/O 64TQFP

Microchip Technology

4,761 -
EX128-TQG64I

数据手册

EX 64-LQFP Tray Active Not Verified - 256 - 46 6000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 64-TQFP (10x10)
EX128-TQ64I

EX128-TQ64I

IC FPGA 46 I/O 64TQFP

Microchip Technology

2,214 -
EX128-TQ64I

数据手册

EX 64-LQFP Tray Obsolete Verified - 256 - 46 6000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 64-TQFP (10x10)
A3P1000L-1FG144I

A3P1000L-1FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,789 -
A3P1000L-1FG144I

数据手册

ProASIC3L 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
AGL250V2-FGG144I

AGL250V2-FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,303 -
AGL250V2-FGG144I

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 6144 36864 97 250000 1.14V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
AGL400V2-CSG196I

AGL400V2-CSG196I

IC FPGA 143 I/O 196CSP

Microchip Technology

4,148 -
AGL400V2-CSG196I

数据手册

IGLOO 196-TFBGA, CSBGA Tray Active Not Verified - 9216 55296 143 400000 1.14V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 196-CSP (8x8)